Senior Staff Packaging Engineer - Semiconductor Industry

Renesas Electronics · 📍 Bali, Indonesia · Diposting 2026-10-09
FULL_TIME⭐ TERVERIFIKASI
IDR 500000000 - 800000000
Renesas Electronics is seeking a highly skilled Senior Staff Packaging Engineer to join our team in Bali, Indonesia. As a key member of our engineering department, you will play a crucial role in developing and optimizing semiconductor packaging solutions. This is an exciting opportunity to work in a dynamic and innovative environment, contributing to cutting-edge technology.

📋 Tanggung Jawab Pekerjaan

Lead and manage the design, development, and optimization of semiconductor packaging solutions.,Collaborate with cross-functional teams to ensure successful product development and manufacturing.,Develop and implement packaging processes and technologies to meet product specifications and performance requirements.,Conduct failure analysis and troubleshooting to improve packaging reliability and yield.,Stay updated with industry trends and emerging technologies to drive continuous improvement in packaging processes.,Mentor and guide junior engineers, fostering a culture of innovation and continuous learning.,Work closely with suppliers and partners to ensure timely delivery of packaging materials and components.

🎓 Kualifikasi & Syarat

Bachelor's degree in Electrical Engineering, Materials Science, or a related field.,Minimum of 8 years of experience in semiconductor packaging engineering, with a strong background in advanced packaging technologies.,Proven track record of successful projects and achievements in the semiconductor industry.,Strong knowledge of packaging materials, processes, and reliability testing methods.,Proficiency in industry-standard tools and software, such as Cadence, Ansys, or similar.,Excellent problem-solving skills and the ability to work in a fast-paced, deadline-driven environment.,Strong communication and leadership skills, with the ability to collaborate effectively with cross-functional teams.

🛠️ Keahlian

Advanced packaging technologiesSemiconductor reliability testingFailure analysis and troubleshootingProcess optimization and continuous improvementCross-functional team leadershipIndustry knowledge and trends
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